Adds High-Speed Pick-and-Place Machines to Upgrade SMT Line for Advanced Electronic Manufacturing

Today announced the completion of a core equipment upgrade for its Surface Mount Technology (SMT) production line, officially introducing modular high-speed pick-and-place machines to enhance its manufacturing capabilities. This move advances the company’s shift toward "high-precision, high-flexibility, high-efficiency" smart production, better serving precision manufacturing needs across consumer electronics, automotive electronics, and industrial control sectors.

Industry-Leading Precision & Speed

The newly deployed machines set a benchmark for SMT performance:

Ultra-high placement accuracy: Capable of handling 0201 ultra-small components (0.25×0.125mm) with a ±15μm error margin (Cpk≥1.00) in high-precision mode, ensuring stable placement of QFN, BGA, and other precision ICs while reducing soldering defects.

High-throughput output: Equipped with the H24S placement head, each module achieves a theoretical speed of 42,000 components per hour (cph) in production-priority mode. Parallel operation of multiple modules enables linear capacity scaling, boosting overall efficiency by over 30% compared to legacy equipment.

Industrial-grade reliability: Features a rigid frame and fly vision recognition technology to calibrate component positioning during high-speed operation. With an IP65 protection rating, it maintains consistent performance in harsh industrial environments.

Modular Design for Flexible Production

A key advantage of the lies in its modular architecture:

Flexible line scaling: Single machines can combine multiple independent placement modules, supporting rapid changeovers (under 15 minutes) for small-batch, high-mix orders and large-scale mass production via multi-module parallel setups.

Asset reusability: Compatible with existing SMT line accessories (e.g., placement heads, feeders), minimizing replacement costs.

Smart connectivity: Integrates with MES systems for real-time production monitoring, material traceability, and automated process parameter optimization—laying the groundwork for a future Industry 4.0 smart workshop.

Enhanced Capacity & Quality to Accelerate Order Delivery

A  production leader noted: "Our SMT line now handles everything from microchips to large odd-form components. We’ve cut order lead times by 20% while raising product yield to over 99.8%. This upgrade strengthens our ability to serve mid-to-high-end electronics clients, especially in automotive electronics and 5G communications, where precision and stability are critical."

The new equipment has completed commissioning and entered mass production, with the first NXT III-equipped line already processing smart wearable device PCBs for a consumer electronics client. We plans to continue optimizing its SMT layout to further advance smart manufacturing capabilities..